RB-MEMS Consultant inc.

Our team has vast experience in semiconductor industry with speciality in high volume MEMS microfabrication, multi-substrate MEMS, Wafer-Level Packaging (knowledge in Fan-Out), Optical MEMS (MOEMS), NEMS, photonics,  expert  in DRIE and plasma etching,  photolithography, wet etch, thick resist striping, material deposition (PECVD, PVD reactive sputtering), wafer-level bonding, etc. 

Integration solution for MEMS process microfabrication.

  • MEMS device design and simulation.
  • MEMS process flow design with high volume manufacturing mindset.
  • MEMS Fabrication Prototyping
  • Risk analysis and Risk mitigation plan.
  • Assist your Fabless business model to bring your device into high volume manufacturing.
  • MEMS process debugging. Our team has extensive expertise in plasma etching, photolithography and wafer-level bonding.


  • Developing complex multi-substrate MEMS/MOEMS processes (involving up to 6 wafer-level bondings).
  • MEMS design and electro-mechanical simulations.
  • Deeply involved in many MEMS projects, some involving in depth material science, some micro-mirrors, IR-imagers, some involving acoustics, inertial sensors, fluidic device, pressure sensors, etc. This includes many aspects such as process step development, material properties development, process tool modifications, handling tools modification development, and very low defect level optimization.
  • Experience in Wafer Level Packaging and knowledge in Fan-Out.
  • Extensive knowledge in DRIE, plasma etching, photolithography, wet etch, TMAH,  striping, PECVD, Sputter deposition, wafer-level bonding, VHF, etc.
  • Experience in challenging etching development: Filled Through Silicon Via, TSV reveal, 2-level DRIE, dry etching of exotic materials, complex DRIE shapes, tight critical dimensions for inertial devices, etc.

Also Offers training course on "Plasma Etching for Semiconductors" (1-day course)
Next course, please contact: richard.beaudry@rb-memsconsultant.com